Description
Hack-saw frame designed to remove excesses from the interproximal area
Designed to removal excesses of composites, adhesives, cements and amalgams from the proximal area. Also indicated for Inlay and Onlay, laminated veneers and stripping in orthodontic procedures.
 
Features and Benefits
Device developed to adapt special components:
Saw Blade: – remove surplus material without damage the contact point
thickness of only 0,05mm
Diamond Strip: – allows to perform the stripping in orthodontic procedures
thickness of only 0,1mm
Easy and Safe handling
All components are autoclavable